FINEPLACER® Reballing Module


FINEPLACER^® core	FINEPLACER^® core^plus	FINEPLACER^® pico rs	FINEPLACER^® micro rs	FINEPLACER^® jumbo rs

The Reballing Module allows solder sphere arrays to be restored on custom specified BGA or CSP components after residual solder has been removed.

The module works together with the FINEPLACER^® top and bottom heating ensuring highly reproducible results.

The alignment of stencil and component pads is performed with the rework system's high precision optics.

Highlights

	Fineplacer^® Rework Systems
	Top Heating Module
	Bottom Heating Module
	COMISS Soldering Software
	Process Gas Switching
	Motorized Pivot Arm
	Process Start Sensor
	Soldering Nozzles
	Video Module
	Illumination Systems
	Solder Removal Module
	Dispenser Module
	DCP Module
	Flux Transfer Module
	Solder paste printing
	Component Presentation
	Positionig Head
	BGA / CSP Reballing
	Solder Fume Extraction Module
	Spare-parts