FINEPLACER® Dispenser Module


FINEPLACER^® core	FINEPLACER^® core^plus	FINEPLACER^® pico rs	FINEPLACER^® micro rs	FINEPLACER^® jumbo rs

dispens process

With a Dispenser Module various materials such as adhesives, flux or solder paste can be applied onto substrates, PCBs and chips.

The Dispenser Module is composed of a machine specific feeder system (support) and a suitable device to control the dispensing parameters.

Highlights*

Defined dispensing position using high precision vision alignment system
Includes dispensing any fluid or paste material
Precise adjustment with micrometer screws in x, y, z
Supports cartridge sizes from 3 to 5ccm
Feeding system supports various dispenser types: time-pressure, valve, screw and jet

* depending on system and configuration

	Fineplacer^® Rework Systems
	Top Heating Module
	Bottom Heating Module
	COMISS Soldering Software
	Process Gas Switching
	Motorized Pivot Arm
	Process Start Sensor
	Soldering Nozzles
	Video Module
	Illumination Systems
	Solder Removal Module
	Dispenser Module
	DCP Module
	Flux Transfer Module
	Solder paste printing
	Component Presentation
	Positionig Head
	BGA / CSP Reballing
	Solder Fume Extraction Module
	Spare-parts