 | Phone: +49(0) 5691-6287-0 | ||
 |  | Fax: +49(0) 5691-6287-29 | |
| Contact: mailto: JOERNS GmbH |
FINEPLACER®
Hot Air SMD Rework Stations
High Density Rework Station
FINEPLACER® pico rs
The FINEPLACER® pico rs rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.
The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The FINEPLACER® pico rs system is at home in R&D, process development, prototyping and production environments.
Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.
Highlights*
- Industry-leading thermal management
- Components from 0.125 x 0.125mm to 90 x 70mm*
- Board sizes up to 400 x 234mm*
- High efficiency board heater
- Closed loop force control*
- Automated top heater calibration*
- Placement accuracy better than 5µm
* depending on configuration
Features
- Automated soldering processes
- Overlay vision alignment system (VAS) with fixed beam splitter
- Modular design
- Integrated Process Management (IPM)
- Real time process observation camera
- Adaptive process library
- Process transfer from system to system
Benefits
- Hands-off component placement, user independent process operation
- Outstanding placement accuracy and instant operation without adjustments
- Provides high level of application flexibility
- Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination
- Immediate visual feedback reduces process development time
- Fast and easy process development
- Identical results on different machines allow central profile development,administration and distribution
Processes
- Component removal
- Site cleaning
- Reballing (array, single)
- Paste printing (component, PCB)
- Paste dipping
- Fluxing
- Soldering
- Desoldering
Applications
- Soldering of:
- BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
- Small passives down to 01005
- RF shields, RF frames
- Connectors, sockets
- Sub assemblies, daughter boards
- Pin in Paste (PiP)
- Trough Hole Reflow (THR)
- Reworkable underfill, conformal coating
- Single ball rework
| Technical Specifications | |
| Placement accuracy | 5µm |
| Field of view (min) | 11.5 x 8.6mm |
| Field of view (max) | 69 x 53mm |
| Component size (min) | 0.125 x 1.125mm |
| Component size (max) | 40 x 40mm |
| Thermocouples | 2 - 8 |
| Top Heating | |
| Power | 900W |
| Temperature ramp rate | 1 - 50K/s |
| Flow range | 10 - 70Nl/min |
| Board Heating | |
| Power | 1600W |
| Heated area (max) | 280 x 250mm |
| Flow range | 32 - 160Nl/min |
Modules & Options
- Board Printing Tools
- Top Heating Module
- Bottom Heating Modules
- Component Presentation
- Direct Component Printing Module (DCP)
- Dispenser Module
- Flux Transfer Module
- Process Gas Switching
- Process Start Sensor
- Process Video Module
- Reballing Module
- Solder Removal Module
- Split Field Optics
