The ONYX 21 offers high professional rework capabilities at a favourable price. For smaller printed circuit boards and simple applications with the goal to have high reliable solder results.

TECHNICAL DESIGN

The ONYX 21 has been designed according to applications requirements in a compact machine design.
The compact machine design nevertheless doesn't make compromise on the functionality: it offers force measurement, strong top and bottom heating, nitrogen connection and modularity as a standard.

STRONG TOP AND BOTTOM HEATING

The preheater 300x300mm offers powerful 3500 W for bottom heating and 2000 W for top heating.
Important for higher temperatures and exact temperature profiling for leadfree applications.

EXTERNAL SITE CLEANING OPTION

The external site cleaning option with an adjusted fixed height is outlined for use on the ONYX 21 for contactless site cleaning after removal of a component.
The residue solder is removed without touching or damaging the surface of the printed circuit board.
The site is cleaned and ready for a new component to be soldered in after applying flux and paste if necessary.

FORCE PLACEMENT

The Z-axes is motorized and places the the component automatically with force in the gramme range onto the board to protect sensitive components.

IR PREHEATER

For controlled and strong preheating and avoiding warpage.
With this and the optional board cooling the cycle time can be reduced to a minimum and the temperature profile does meet the requirements even of sophisticated applications.

ONYX 21 KEY FEATURES SUMMARY

• AXIS MOVEMENTS
  motorised Vision- and z-axis, closed loop motion control
• COMPACT, STABLE DESIGN
  for smaller boards, but also capable of handling boards up to 300x400mm
• STRONG TOP AND BOTTOM HEATING
  2000 W top site heater; 3500 W 300x300mm bottom side preheating
• BOARD COOLING
  the board cooling options adds benefits for leadfree soldering and faster process times
• EXTERNAL SITE SOLDER CLEANING SYSTEM
  option for external site solder removal system for redressing after removal of component
• CLOSED LOOP AIRFLOW CONTROL
• STANDARD GAS NOZZLES
• 4 THERMOCOUPLE PORTS
  to control process temperatures
• FORCE MEASUREMENT
  Closed loop force control for automatic picking, fluxing, placing and removing
• VISION
  Available as SFOV or MFOV Version, the Vision System allows viewing of the board layout and the component pattern at the same time, adjustable Vision LED illumination intensity

Moduls and Optios

• IR-Sensor
• Board cooling
• MFOV-Vision
• Component shuttle with force measurement
• Foot switch
• Direct View Camera System
• Fume extraction