Applications

For repair, prototyping, selective soldering, retrofit and smaller production units in the full range of through-hole technology applications for selective soldering and desoldering.

Defective components can be removed and new components soldered in. Suitable for very densely packed circuit boards, mixing molds and / or double-sided or multi-layer circuit boards.

Reproducible results

Parameters such as soldering temperature, cycle time, wave height, heating and cooling ramp can be entered, programmed and stored and provide user-independent and reliable soldering results.

The parameters are entered via the control panel, up to 10 programs can be stored and retrieved as required.