JOERNS GmbH  Phone: +49(0) 5691-6287-0
DEFax: +49(0) 5691-6287-29
  Contact: mailto: JOERNS GmbH

FINEPLACER®
Hot Air SMD Rework Stations

Large Area Rework Station
FINEPLACER® jumbo rs

FINEPLACER® jumbo rs

The FINEPLACER® jumbo rs is a hot air rework station dedicated to handling medium to large sized boards and SMD components with high heat absorption.

Capable of handling the smallest components with pitch down to 200 micron to large BGA components, utilizing a large field of view.

The open system architecture system allows performance of the complete rework cycle within one platform.

Highlights*

  • Components from 0.5 x 0.5mm to 90 x 140mm*
  • Board sizes up to 750 x 500mm*
  • 4 zone segment board heater with flexible board holder*
  • Closed loop force control*
  • Automated top heater calibration*
  • Placement accuracy better than 15µm

* depending on configuration


Features

  • Automated soldering processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Modular design
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Adaptive process library
  • Process transfer from system to system

Benefits

  • Hands-off component placement, user independent process operation*
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination
  • Immediate visual feedback reduces process development time
  • Direct process transfer from development to production saves time and guarantees reliable results anywhere
  • Process library allows fast and easy process development for perfectly tailored soldering profiles

* depending on configuration


Processes

  • Component removal
  • Site cleaning
  • Reballing (array, single)
  • Paste printing (component, PCB)
  • Paste dipping
  • Paste dispensing
  • Fluxing
  • Soldering
  • Desoldering

Applications

  • Soldering of:
    • BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
    • Small passives down to 0603
    • RF shields, RF frames
    • Connectors, sockets
    • Sub assemblies, daughter boards
  • Pin in Paste (PiP)
  • Trough Hole Reflow (THR)
  • Reworkable underfill, conformal coating
  • Single ball rework

Technical Specifications
Placement accuracy15µm
Field of view (min)13 x 9.5mm
Field of view (max)83 x 62mm
Component size (min)0.5 x 0.5mm
Component size (max)80 x 80mm
Thermocouples2 - 8
Top Heating
Power900W
Temperature ramp rate1 - 50K/s
Flow range10 - 70Nl/min
Board Heating
Power3500W
Heated area (max)475 x 380mm
Flow range160Nl/min

Modules & Options

  • Board Printing Tools
  • Top Heating Module
  • Bottom Heating Modules
  • Component Presentation
  • Direct Component Printing Module (DCP)
  • Dispenser Module
  • Flux Transfer Module
  • Process Gas Switching
  • Process Start Sensor
  • Process Video Module
  • Reballing Module
  • Solder Removal Module
  • Split Field Optics