FINEPLACER®
Hot Air SMD Rework Stations
Energy-efficient Rework Station
FINEPLACER® core
The FINEPLACER® core is a versatile rework system offering energy-efficient hot gas rework technology for a wide spectrum of SMD components from smallest components to large BGA.
The easy-to-handle machine integrates the complete SMD rework cycle into an compact design, without diminishing functionality. Quite on the contrary, professional features such as digital calibration, Process Start Sensor, Process Gas Switching, 01005 Rework Package, PCB recognition by Bar Code Scanning and a touch screen user interface are available, making the system a future-proof investment.
A high efficiency bottom heating developed for rework of small sized PCBs, e.g. for mobile devices.
Highlights*
- Component sizes from 0.125 x 0.125mm up to 70 x 70mm**
- Eco-friendly thermal management solution with high-efficiency hot gas top and bottom heating
- Digital top heater calibration
- Automatic pick-up / touch-down with force measurement
- Automated processes
- Gesture-based operating interface
- Compact, integrated machine design
- Cost efficient soldering tools, compatible with all FINEPLACER® rework stations
* depending on configuration
** larger components (up to 90 mm) on request
Features
- Hot gas rework station
- Automated soldering processes
- Compact and robust design
- Vision alignment system with fixed beam splitter
- Intelligent thermal management
- Real time process observation camera
- Digital top heating calibration
- Manual precision Z-travel range of the reflow arm
Benefits
- Even and reproducible heat distribution
- User independent process operation
- The whole rework cycle within one cost-effective system solution
- Reproducible placement accuracy
- Coordinated control of all process parameters: temperature, flow, time, process environment
- Immediate visual feedback reduces process development time
- Quick machine setup time
- Safe handling of sensitive components
Processes
- Component removal / Desoldering
- Site cleaning
- Reballing
- Paste printing (component, PCB)
- Paste dipping
- Fluxing
- Soldering
Applications
- Soldering of:
- BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
- Small passives down to 01005
- RF shields, RF frames
- Connectors, sockets
- Sub assemblies, daughter boards
- Pin in Paste (PiP)
- Trough Hole Reflow (THR)
- Reworkable underfill, conformal coating
Technical Specifications | |
Placement accuracy | 25µm |
Field of view (min) | 12.1 x 7.6mm |
Field of view (max) | 65 x 45mm |
Component size (min) | 0.25 x 0.25mm |
Component size (max) | 60 x 60mm |
Board size (max) | 350 x 310mm |
Board thickness (max) | 6mm |
Thermocouples | 4 |
Top Heating | |
Power | 900W |
Temperature ramp rate | 1 - 50K/s |
Flow range | 10 - 70Nl/min |
Board Heating | |
Power | 900W |
Heated area (max) | 100 x 100mm |
Flow range | 10 - 70Nl/min |
Modules & Options
- Board Printing Tools
- Component Presentation
- Direct Component Printing Module
- Flux Transfer Module
- Process Gas Switching
- Process Start Sensor
- Process Video Module
- Reballing Module
- SmartIdent
- SmartControl
- Solder Removal Module
- Split Field Optics Zoom Optics